Iridium Oxide Titanium Electrode for Plating Copper
1. Low battery voltage and low energy consumption;
2. small loss rate of electrode and stable size;
3 long service life, reusable substrate, cost saving;
Product Introduction
Iridium Oxide Titanium Electrode For Plating Copper are coated with noble metal oxides with high electrochemical catalytic performance on a titanium substrate (mesh, plate, strip, tube, etc.), which contains highly stable valve metal oxides. The new insoluble titanium anode also has a lower oxygen precipitation overpotential than the platinum-plated insoluble anode, but has a lifetime that is more than one times longer.
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Substrate |
Gr1 titanium sheet |
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Coating type |
iridium oxide |
|
Coating thickness |
8-20μm |
|
Shape |
Sheet/rod/mesh/wire or as customized |
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Working Parameter
|
Current density≤2000A/M2 Temperature<60°C Max content of Fluoride ion is 200PPM |
|
Electrolyte |
H2SO4, HCL or HNO3 |
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Applications |
Plating for Cu, Zn,Ni,Co,Mn,Pd,Cr,Ag,Au,Rh etc |
|
Feature |
Insoluble anode, dimensionally stable Stable distance between anode and cathode, stable cell voltage Low working voltage, power saving / electricity saving High purity of electroplating material No cell contamination Light weight Titanium material can be recycled High current efficiency and catalytic performance Long service life |
Quality R&D:
Our service:
Shape and size customization
Coating customization
Quality testing
Shipping &packaging:
Customer feedback:
Why choose us:
Xubo manufactures Iridium Oxide Titanium Electrode For Plating Copper by thermal decomposition. The iridium and tantalum chloride precursors are first dissolved in an aqueous solution and then brushed onto the titanium substrate in multiple layers. The heat treatment is carried out at around 400°C to achieve the desired coating thickness.
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