Shaanxi Xubo Titanium Metal Technology Co., Ltd

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Why Choose Us
 

Rich Experience
Shaanxi xubo titanium metal technology Co., Ltd are a professional rare metal manufacturer and supplier for 12 years.we are focused on diversification and have invested heavily in R&D, production and marketing.

 

High Quality
We adopt advanced production facilities, process standards, and management system to control producing process and obtained ISO:9001 Quality Control System. Our products are certified by world-class companies such as BV CNAS ISO SGS.

 

Wide Range of Products
Mainly specialized in RD and manufacturing MMO titanium anode, Titanium electrode, Platinised titanium anode, lead oxide anode, CNC metal titanium parts, titanium plate, titanium bar, titanium tube, titanium wire, titanium target, and related titanium products.

 

Competitive Prices
Our prices are competitive and fair, there are no surprise bills. Any unexpected or additional expenses must be pre-approved by you. That's how our clients are treated.

 

What Is Sputtering Target

 

 

A sputtering target is a metal or alloy disk used for depositing compound thin films through an inefficient process called sputtering. It is usually mounted on a water-cooled backing plate and surrounded by a dark space shield to ensure that only the target material is sputtered.

 
Advantages of Sputtering Target
 
01/

High purity deposition: It allows for the deposition of high-purity thin films since it does not involve chemical reactions. This makes it suitable for applications where material purity is critical, such as in microelectronics.

02/

Controlled film thickness: It provides precise control over the thickness of the deposited film, enabling the production of thin films with specific thickness requirements.

03/

Uniform coating: Sputtering target typically results in uniform film deposition across the entire substrate surface, ensuring consistency in film properties.

04/

Wide material compatibility: Sputtering target can be used with a wide range of materials, including metals, semiconductors, ceramics, and even some polymers, making it versatile for various applications.

05/

Excellent adhesion: Sputtered films often exhibit strong adhesion to the substrate, reducing the risk of delamination or peeling.

06/

High-density films: The high packing densities of high-density films can lead to improved mechanical and electrical properties.

 

What Is The Lifetime Of A Sputtering Target
Titanium Sputtering Target for Vacuum Coating
Tungsten Sputtering Target Functional Coating
Tungsten Sputtering Target
Big Diameter Zirconium Sputtering Target Coating

The lifetime of a sputtering target depends on several factors, including the material of the target, the power applied, the duty cycle, and the specific application. Typically, sputtering targets are designed to withstand the high-energy bombardment of ions without overheating, thanks to a pulsed application of high voltage energy and periods of cooling during the off-duty time. This results in a low average cathode power, which helps maintain process stability and extends the target's lifetime.


The actual lifetime can vary widely. In microelectronics, where targets are used to deposit thin films of materials like aluminum, copper, and titanium, the target may last for several hours to a few days, depending on the thickness of the film being deposited and the intensity of the sputtering process. In other applications, such as in decorative coatings or thin film solar cells, the lifetime might be longer if the deposition rates are lower or the target material is more durable.


The sputtering process itself involves a complex interplay of parameters, including the type of sputtering gas (often an inert gas like argon), the background gas pressure, and the mass of the target and projectile. These factors can influence how quickly the target material is depleted and thus affect the target's lifetime. Using heavier gases like krypton or xenon for sputtering heavy elements can lead to more efficient momentum transfer and potentially extend the target's life.


The design of the sputtering system, such as the presence of a magnet array and cooling mechanisms, can also impact the target's longevity. Cooling water inside the target cylinder helps dissipate heat generated during the process, preventing overheating and prolonging the target's usability.


The lifetime of a sputtering target is not a fixed value but depends on the specific conditions and parameters of the sputtering process. It can range from a few hours to several days or even longer, depending on the application and the efficiency of the system's design in managing heat and power.

 

What Are the Uses of Sputtering Targets

 

● Decorative coating
Decorative coating mainly refers to the surface coating of mobile phones, watches, glasses, sanitary ware, hardware parts and other products, which not only plays the role of beautifying color but also has wear-resistant, corrosion-resistant and other functions. With the continuous improvement of people's living standard, more and more articles of daily use are required to carry out decorative coating. Therefore, the demand for decorative coating target materials is increasing day by day. The main types of coating materials include a chrome target, tantalum target, zirconium target, nickel target, tungsten target, titanium target and stainless steel target.


● Glass coating
The application of target materials in the glass is mainly to make low-radiation coated glass, which is to achieve the function of energy-saving, light control, and decoration by using magnetron sputtering principle to splash multilayer film on the glass. The traditional building glass is gradually replaced by the energy-saving glass in recent years with the increasing demand for energy saving, emission reduction and improvement of people's quality of life. It is driven by this market demand that almost all large glass deep-processing enterprises are rapidly increasing the production line of coated glass. Correspondingly, the demand for coating target materials is increasing rapidly. The main types of glass coating target materials include silver target, chromium target, titanium target, nickel-chrome target, zinc tin target, silicon aluminum target, and titanium oxide target.


Another important application of target material in the glass is to prepare an automobile rearview mirror, which is mainly made by chrome target, aluminum target, and titanium oxide target. With the continuous improvement of the automotive rearview mirror, many enterprises have changed from the original aluminum plating process to the vacuum sputtering chromium plating process.


● Tools coating
The tools coating is mainly used to strengthen the surface of tools and molds, which can greatly improve the service life of tools and molds and the quality of the parts being processed. Driven by the development of aerospace and automobile industry, the technological level and production efficiency of the global manufacturing industry have made great progress, and the demand for high-performance tools and molds is increasing day by day. According to statistic, the coating proportion of tool used for processing in developed countries has exceeded 90%. The main types of target materials used for coating of industrial tools include titanium aluminum target, chromium aluminum target, chromium target and titanium target.


● Solar cell coating
With the decrease of traditional petrochemical material energy, the world has turned to renewable energy. Solar cells are now in their third generation. The first generation is monocrystalline silicon solar cell, the second generation is amorphous silicon and polycrystalline silicon solar cell, and the third generation is thin-film solar cell (represented by CIGS), and the sputtering coating process is a preferred preparation method. The main targets for solar cell coating include zinc oxide aluminum target, zinc oxide target, zinc aluminum target, molybdenum target, cadmium sulfide target, copper indium gallium selenium target, etc.

 

Performance of Sputtering Target Materials

 

 

A sputtering target is a material that is used to create thin films in a technique known as sputter deposition, or thin film deposition. During this process the sputtering target material, which begins as a solid, is broken up by gaseous ions into tiny particles that form a spray and coat another material, which is known as the substrate. Sputter deposition is commonly involved in the creation of semiconductors and computer chips. As a result, most sputtering target materials are metallic elements or alloys, although there are some ceramic targets available that create hardened thin coatings for various tools.


Depending on the nature of the thin film being created, sputtering targets can very greatly in size and shape. The smallest targets can be less than one inch (2.5 cm) in diameter, while the largest rectangular targets reach well over one yard (0.9 m) in length. Some sputtering equipment will require a larger sputtering target and in these cases, manufacturers will create segmented targets that are connected by special joints.


The designs of sputtering systems, the machines that conduct the thin film deposition process, have become much more varied and specific. Accordingly, target shape and structure has begun to widen in variety as well. The shape of a sputtering target is usually either rectangular or circular, but many target suppliers can create additional special shapes upon request. Certain sputtering systems require a rotating target to provide a more precise, even thin film. These targets are shaped like long cylinders, and offer additional benefits including faster deposition speeds, less heat damage, and increased surface area, which leads to greater overall utility.

 

The effectiveness of sputtering target materials depends on several factors, including their composition and the type of ions used to break them down. Thin films that require pure metals for the target material will usually have more structural integrity if the target is as pure as possible. The ions used to bombard the sputtering target are also important for producing a decent quality thin film. Generally, argon is the primary gas chosen to ionize and initiate the sputtering process, but for targets that have lighter or heavier molecules a different noble gas, such as neon for lighter molecules, or krypton for heavier molecules, is more effective. It is important for the atomic weight of the gas ions to be similar to that of the sputtering target molecules to optimize the transfer of energy and momentum, thereby optimizing the evenness of the thin film.

 

5 Points You Should Know in the Sputtering Target Maintenance
 
● Sputtering target maintenance

In order to avoid short circuit and arc initiation caused by the unclean cavity in the sputtering process, it is necessary to remove the accumulated sputtering materials deposited in the middle and on both sides of the sputtering track in stages. It is also helpful for users to continuously sputtering with the maximum power density.

● Sputtering targets storage

We suggest that users store the sputtering material, whether it is metal or ceramic, in vacuum packaging. In particular, the bonding target material must be stored in vacuum conditions to avoid the adhesion layer oxidation, which will affect the quality of the target bonding. For the packaging of metal target materials, we suggest that a clean plastic bag should be used at least.

● Sputter target cleaning

Step 1. Clean the sputtering target with a soft, lint-free cloth soaked in acetone;
Step 2. Similar to the first step, clean the target with alcohol;
Step 3. Wash the target material with deionized water. After that, place the target in an oven and dry it at 100 degrees celsius for 30 minutes.
Step 4. Rinse the target with high pressure, low moisture argon to remove any impure particles that may cause arcing in the sputtering system.

● Short circuit & tightness check

After the target is installed, it is necessary to do the short-circuit inspection and sealing check on the entire cathode. It is recommended to judge whether there is a short circuit in the cathode by using a resistance meter to shake the watch. After determining that there is no short circuit in the cathode, a leak check can be performed to pass water into the cathode to determine whether there is water leakage.

● Packaging & transportation

All targets are packaged in vacuum-sealed plastic bags with a moisture barrier. The outer packaging is generally a wooden box with an anti-collision layer around it to protect the target and the back target from damage during transportation and storage.

 

Our Factory

 

Shaanxi xubo titanium metal technology Co., Ltd is mainly specialized in RD and manufacturing MMO titanium anode, Titanium electrode, Platinised titanium anode, lead oxide anode, CNC metal titanium parts, titanium plate, titanium bar, titanium tube, titanium wire, titanium target, and related titanium products. Which are widely used in water treatment, swimming pools, electrolysis, disinfection, the alkali industry, electroplating, cathodic protection, medical, chemical, sport, aerospace, etc. It is located in"China Titanium Valley" Baoji city, we adopt advanced production facilities, process standards, and management system to control producing process and obtained ISO:9001 Quality Control System Most our products are widely exported to Brazil, Argentina, and USA, Germany, Korea, Vietnam, France, Italy, etc more than 50 countries. Our objective is "To make better Titanium Solutions for your usage"We strive to provide more perfect and cost-effective titanium solutions for global partners.


We are a professional rare metal producer and supplier for many years. Our products are certified by world-class companies such as BV CNAS ISO SGS, our vision is to enlarge the profits and make our clients satisfied.

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Our Certificates
 

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FAQ
 

Q: What is sputtering target?

A: A sputtering target is a metal or alloy disk used for depositing compound thin films through an inefficient process called sputtering. It is usually mounted on a water-cooled backing plate and surrounded by a dark space shield to ensure that only the target material is sputtered.

Q: How do I clean oil-covered sputtering targets?

A: Sputtering targets that react with air or water vapor are protected during storage and shipment by immersion in a low viscosity (hydrocarbon) mineral oil. Before the material can be installed in a vacuum system, this oil must be completely removed using solvents that do not act as additional contamination sources for the vacuum system or the subsequent thin-film processes.

Q: How to make sputtering target?

A: Double stone steel
Choose a suitable target material and shape.
Prepare the target material by melting, casting, forging, rolling, or powder metallurgy techniques.
Bond the target material to a backing plate using thermal spraying, diffusion bonding, soldering, brazing, or epoxy techniques.

Q: What size is a sputtering target?

A: Our standard round target sizes range from 1 inch to 20 inches in diameter, and the rectangular targets are available in lengths up to and over 2000 mm in single or multiple-piece construction, depending on the metal.

Q: How do you clean sputtering targets?

A: Step 1 Clean the sputtering target with a soft, lint-free cloth soaked in acetone; Step 2 Similar to the first step, clean the target with alcohol; Step 3 Wash the target material with deionized water. After that, place the target in an oven and dry it at 100 degrees Celsius for 30 minutes.

Q: What is the lifetime of a sputtering target?

A: In summary, the lifetime of a sputtering target is not a fixed value but depends on the specific conditions and parameters of the sputtering process. It can range from a few hours to several days or even longer, depending on the application and the efficiency of the system's design in managing heat and power.

Q: What is the diameter of a sputtering target?

A: Sputter target diameters start from 20mm up to 101.6mm and come in various thicknesses. The physical properties of some materials will limit the thicknesses available, they can range from 0.1mm to 5mm. Diameters up to 500mm and thickness up to 50mm can be sourced for some materials.

Q: Who uses sputtering targets?

A: Sputtering targets are used to make thin films in many different industries. These thin films are used to make things like semiconductor manufacturing, hard drives, and solar panels. In semiconductor manufacturing, sputtering targets are used to put tiny bits of metal and other materials onto silicon wafers.

Q: What is the power density of sputtering target?

A: For applications involving sputter applications with more highly conductive metallic targets the general rule of thumb is to restrict the maximum power density to around 250 watts/sq. in. with direct water cooling cathode assemblies and closer to around 100 watts/in. sq.

Q: What are sputtering targets made of?

A: Sputtering targets are made of various materials depending on their purpose. These can be metals, ceramics, alloys, or composites.
Metal targets are commonly used because they conduct heat and electricity well and can create many different alloys. Examples of metals used for sputtering include gold, silver, copper, aluminum, and titanium.
Ceramic targets are known for their strength, resistance to wear, and resistance to chemicals. Examples of ceramics used for sputtering include aluminum oxide, silicon dioxide, and titanium dioxide.
Alloy targets are made by mixing two or more metals to create specific physical or chemical properties. For instance, a mixture of gold and silver can create a thin film that is conductive, but not as much as pure gold or pure silver.
Composite targets are produced by mixing different materials, such as metal and ceramic, to create a specific combination of properties. For example, a composite target made of copper and aluminum oxide can produce a thin film that is highly conductive and adheres well to a surface.

Q: How does sputtering target material work?

A: Sputtering is a way to transfer material from a sputtering target to a substrate surface. This happens in a vacuum chamber when a low-pressure gas (usually argon) is introduced.
The gas is turned into a plasma by an electrical discharge, creating positively charged ions and free electrons. These ions move towards the sputtering target and hit its atoms, knocking them loose. These atoms then travel through the vacuum chamber and stick to the substrate surface, creating a thin film.
There are different ways to sputter, like DC sputtering and RF sputtering, reactive sputtering, and magnetron sputtering. Each way has its pros and cons, depending on the application and desired properties of the thin film.

Q: What is the principle of magnetron sputtering for sputtering target materials?

A: Magnetron sputtering principle: add an orthogonal magnetic field and electric field between the target electrode (cathode) and anode to fill the required inert gas (usually Ar gas) in the high vacuum chamber. Permanent magnet forms a magnetic field of 250-350 Gauss on the surface of the target material, and forms an orthogonal electromagnetic field with the high voltage electric field. Under the action of electric field, Ar gas ionizes into positive ions and electrons. A certain negative high pressure is added to the target. The electron from the target pole is affected by the magnetic field and the ionization probability of working gas increases. A high density plasma is formed near the cathode. Ar ions accelerate to the target surface under the action of Lorentz force, bombard the target surface at a high speed, so that the atoms sputtering on the target follow the target Momentum conversion principle is used to deposit film by moving away from target surface with high kinetic energy. Magnetron sputtering is generally divided into two types: Tributary sputtering and RF sputtering, in which the principle of tributary sputtering equipment is simple, and the rate is also fast when sputtering metal. The RF sputtering is widely used. Besides sputtering conductive materials, it can also sputter non-conductive materials, and reactive sputtering is also used to prepare oxide, nitride and carbide. If the RF frequency is increased, it will become microwave plasma sputtering, and the common use is ECR type microwave plasma sputtering.

Q: What is the target in the sputtering process?

A: A sputtering target is a metal or alloy disk used for depositing compound thin films through an inefficient process called sputtering. It is usually mounted on a water-cooled backing plate and surrounded by a dark space shield to ensure that only the target material is sputtered.

Q: How to maintain sputtering targets?

A: To make sure your sputtering targets last long and perform well, you need to take good care of them. Here's how:
Store targets in a clean, dry place, away from things that might make them dirty.
Handle targets carefully, using clean gloves and tools so you don't add dirt to them.
Check targets often for wear and tear, like cracks or pits, which can make them work worse.
Clean targets often to get rid of any dirt or other stuff that has built up on them.

Q: What size is a sputtering target?

A: Our standard round target sizes range from 1 inch to 20 inches in diameter, and the rectangular targets are available in lengths up to and over 2000 mm in single or multiple-piece construction, depending on the metal.

Q: Are there any special procedures I need to follow before use sputtering target?

A: Most ceramic targets benefit from being bonded to a backing plate to increase target cooling. In addition, the target must be conditioned prior to depositing films from it.

Q: How do I find the mass or weight of a circular sputtering target (measurements in millimeters)?

A: Mass (m) = Pi x (D/20)2 x (T/10) x Density; where D = Diameter (millimeters), T = Thickness/Length (millimeters), Density (grams/cm3).

Q: What is sputtering target for semiconductors?

A: The high purity helps ensure products are not affected by impurities during long-term use. In the case of magnetic materials, the magnetic properties are stable. Diffusion bonding is also possible. Surface thickness uniformity is excellent.

Q: How do I find the mass or weight of a circular sputtering target (measurements in inches)?

A: Mass (m) = Pi x (2.54D/2)2 x 2.54T x Density; where D = Diameter (inches), T = Thickness/Length (inches), Density (grams/cm3).

Q: How do I find the mass or weight of a rectangular sputtering target (millimeters)?

A: Mass (m) = L/10 x W/10 x T/10 x Density; where L = Length (millimeters), W = Width (millimeters), T = Thickness (millimeters), Density (grams/cm3).

As one of the leading sputtering target manufacturers and suppliers in China, we warmly welcome you to buy or wholesale cheap sputtering target in stock here from our factory. All customized products are with high quality and competitive price.

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