
Tungsten Sputtering Target
The tungsten target produced by Xubo has high purity, low gas content, high density, uniform grain and good compactness
Product Introduction
Tungsten target is also known as tungsten sputtering target. It is made from pure tungsten powder and has a silver-white appearance. This product is very popular because of its outstanding physical and chemical properties.
Tungsten sputtering target parameters:

Tungsten target coposition:
|
chemical composition(WT%) |
|||||
|
w |
Al |
Ca |
Fe |
Mg |
Mo |
|
Remainder |
0.002 |
0.005 |
0.005 |
0.003 |
0.01 |
|
Ni |
Si |
C |
N |
O |
|
|
0.003 |
0.005 |
0.008 |
0.003 |
0.005 |
|
Tungsten sputtering target characteristics
1) High purity. The purity of the target material following sintering or forging can often be higher than 99.95%. The general rule is that if all other conditions are unchanged, the purity of the target materials will determine the electrical properties of the resulting coating. This will make it less likely that the circuits involved will be damaged or short-circuited.
2) The cost of direct compression molding using powder metallurgy can be relatively low. It also speeds up the process, which can reduce the production cycle and lower the cost.
(3) The density is high. After sintering or forging, the target density can exceed 19.1g/cm3.
4) The deflection force of the target is high and the composition and structure are consistent with ultra-fine tungsten powder.
5) Excellent thermal and chemical stability, not susceptible to volume expansion or shrinkage.
6) The resistance is low so that the circuit will not generate excess energy.
It also has high melting points, high elasticity and low expansion coefficients.
Target materials, Sputtering targets production process
It is usually prepared using powder metallurgy.
To begin, place tungsten powder into a vacuum heat treating furnace. Next, add hydrogen to the furnace and heat for degassing.
The second step is to heat press the degassed powder of tungsten.
To complete secondary sintering, the product is passed through a hot isostatic press.
Forth,The product is obtained by grinding the entire surface of the product after secondary sintering by machining.
Notice: 1) The purity level of tungsten powder should not be lower than 99.999% and the particle size should range between 3.2 to 4.2 mm
Tungsten Target Applications
It is widely used in flat panel displays, solar cells, integrated circuits, automotive glass, microelectronics, memory, X-ray tubes, medical equipment, melting equipment and other products.
Note: The purity, density, microstructure, internal quality, welding quality, appearance quality and geometric size of the target have important influence on the good or bad coating. China tungsten Online specializes in providing high quality Tungsten W Sputtering Targets target products.

Sputtering target production process:

our service:

custom size
Shape customization
Material Testing(PMI)
Sputtering target production Package:

customer feedback:



2,Just-in-time service allows to optimize the customer's operations.
3,We can make Tungsten Sputtering Target in any other size and many other pieces. Please feel free to contact us via our email sales@xuboti.com.
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