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Iridium Coated Titanium Anode for Pcb Reverse Pulse Copper Plating

Xubo specializes in manufacturing PCB special titanium anodes! Lower consumption, longer service life

Product Introduction

Due to the design requirements of circuit boards tend to fine wire diameter, high density, fine aperture (high depth to diameter ratio, even micro-through hole), filling blind holes, the traditional DC plating becomes more and more unable to meet the requirements, especially in the through-hole plating of the aperture center of the plating layer, usually appear at both ends of the aperture of the copper layer is too thick but the center of the copper layer is not enough phenomenon. This uneven plating will affect the effect of current delivery and directly lead to poor product quality. In order to balance the thickness of copper on the surface, especially in the holes and microvias, the current density is forced to be reduced, but this will extend the plating time to an unacceptable level. With the development of plating processes, Iridium Coated Titanium Anode For PCB Reverse Pulse Copper Plating and chemical additives suitable for the plating process, shortening the plating time became a reality and these problems can be overcome by the reverse pulse plating process.

Typical process conditions：

Electrolyte	CuSO4-5H2O, 100-300 g/l
	H2SO4, 50-150 g/l
Temperature	20- 70 °C
Current density	Usually 500-1000A/M2 forward pulse current and three times reverse pulse current; generally 19ms forward pulse, 1ms reverse; or adjust the current density and pulse time according to the process
Anode type	Special iridium metal oxide mixture coating,special requirements for the consumption of additives

Titanium Anode Test Conditions：

Electrolyte	2L
Sulfuric acid	200ml/L
Temperature	80°C
Current	20A
Anode size	2c㎡
Anode and cathode distance	12.5CM
Current density	1000ASD
Voltage	rises to 15V timing
Aging time	more than 1200 minutes